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What's New

2009-07-01
Between 1 and 30 June 2009, 45 newly funded projects are added to this website for public access.

2009-05-19
Applications for the Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS) and Tier 3 of the Innovation and Technology Support Programme (ITSP) are now invited. Deadline for application is 3 July 2009. Please visit the relevant webpages of TCFS and ITSP for details.

2009-03-23
Applications for the Tier 2 of the Innovation and Technology Support Programme (ITSP) has been closed on 20 March 2009.

2009-03-20
The SERAP Directory 2009 is now available for download.

2009-01-23
The Internship Programme has been expanded to cover private sector companies undertaking R&D projects funded by the Innovation and Technology Fund. Applications for the Programme is accepted all year round. Please click here for details.

2008-10-02
For projects under the Innovation and Technology Support Programme (ITSP), Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS), University-Industry Collaboration Programme (UICP) and General Support Programme (GSP) of the Innovation and Technology Fund (ITF), paragraph 3.1 of the relevant Guides to the ITF states that approval from the Finance Committee of the Legislative Council is required for project requesting more than HK$15 million each from ITF. With immediate effect, the financial ceiling is increased from $15 million to $21 million. Applicants may take this into account in preparing applications to the above funding programmes.





Innovation and Technology Commission GovHK Hong Kong at World Expo 2010

2002 Important Notices Last revision date: 20 May 2009