Innovation and Technology Support Programme (ITSP)
What is ITSP?
ITSP supports midstream/downstream research and development (R&D) projects undertaken mainly by universities, R&D Centres1, industry support organisations, professional bodies and trade and industry associations. ITSP invites applications for funding every six months or so.
Application forms and Guides
The Government adopts a three-tier funding framework for ITSP under the ITF. Tier 1 provides project funding for the R&D centres to undertake projects
in selected focus areas. Tier 2 involves the funding of applied R&D projects which are industry-oriented and have potential for commercialisation.
Tier 3 involves the funding of exploratory and forward-looking projects. The Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS) operates under the ITSP funding framework.
Project proposals for Tier 2 and Tier 3 funding as well as proposals on Automotive Parts and Accessory Systems under the ITSP will be considered by the Innovation and Technology Fund Research Projects Assessment Panel which advises the Commissioner for
Innovation and Technology on the provision of funding support for the applications received. For collaborative projects where the industry co-applicant should contribute at least 50% of the total project cost, an internal assessment panel comprising ITC staff will be convened to assess the applications instead.
The first round of funding applications for 2017 under Tier 2 and Tier 3 of the Innovation and Technology Support Programme (ITSP) is now open to application. Deadline for application is 31 March 2017.
Submission of Applications
Applications of Tier 2 and Tier 3 projects must be submitted to the ITF Secretariat2 either:
- through the Innovation and Technology Commission Funding Administrative System II; or
- in hard copy in triplicate (one original plus two duplicate copies) in person or by post. Please also kindly provide a soft copy (preferably in MS Word 2010 or above), together with an application datasheet (available with the application forms).