What's New

2018-05-01
The second round of Midstream Research Programme for Universities (MRP) has been closed for application after 30 April 2018.
 
2018-04-26
The 2018 Guangdong - Hong Kong Technology Cooperation Funding Scheme (TCFS) is now open for application. Deadline of application is 15 June 2018.
 
2018-03-30
The first round of funding applications for 2018 under Tier 2 and Tier 3 of the Innovation and Technology Support Programme (ITSP) has been closed for application after 29 March 2018.
 
2018-02-28
With effect from 28 February 2018, the eligibility of the Technology Voucher Programme has been relaxed to cover all non-listed local enterprises, irrespective of size and duration of operation. For details, please refer to the Guidance Notes for Applications.
 
2018-01-29
With effect from 29 January 2018, the upper quotation limit for procurement for goods and services stipulated in the “Enterprise Support Scheme (ESS) - Guide to Filling in the Application Form” and the “ESS – Funding and Administration Guidelines for Successful Applicants” has been revised from $1,430,000 to $1,400,000. This new quotation limit applies to ESS applications submitted to the ITC on or after this date. For applications submitted before 29 January 2018, the upper quotation limit of $1,430,000 prevails. For details, please refer to the Guide to Filling in the Application Form and Funding and Administrative Guidelines for Successful Applicants.
 
2018-01-19
The application by venture capital (VC) funds to become co-investment partners under the Innovation and Technology Venture Fund (ITVF) has been closed on 15 January 2018.
 
2017-12-28
Enterprise Support Scheme (ESS) Application Form 7.2 (Form 7.2) is now available. Please use this form to create your new application entry for the ESS. Submission of ESS applications on Form 7.2 through the Innovation and Technology Commission Funding Administrative System is effective from 29 December 2017. If you are still in the process of preparing your applications on Form 7.0 or Form 7.1, you may continue to do so and must submit your applications on or before 31 March 2018. Thereafter, they will be deemed as invalid.

Assessment Panel uses the same set of vetting criteria to consider applications submitted in Forms 7.0/7.1/7.2.

For more information on the completion of Form 7.2, please refer to the “Sample Application Form” and the “ESS – Guide to Filling in the Application Form (ITF Form 7.2)” dated December 2017.
 
2017-12-28
With effect from 29 December 2017, ESS applications (submitted in either electronic copies or hard copies) that have been considered to be incomplete by the ESS Secretariat will be deemed as being withdrawn if the applicants concerned do not submit the missing information/documents or written clarifications as requested by the Secretariat within two months. The ESS Secretariat will then cease processing such applications further. Re-submission is always welcome.

The arrangement specified in paragraph 6 of “ESS – Guide to Filling in the Application Form (ITF Form 7.0/7.1)” dated June 2016 is hereby superseded. The above new arrangement is set out in paragraph 5 of the “ESS – Guide to Filling in the Application Form (ITF Form 7.2)” dated December 2017.
 
2017-12-19
With effect from 19 December 2017, the Internship Programme has been further expanded to cover all innovation and technology tenants of the Hong Kong Science & Technology Parks Corporation and Hong Kong Cyberport Management Company Limited.
 
2017-10-12
With effect from 11 October 2017, the maximum monthly allowance of the Internship Programme has been increased to $16,000 for graduates with a Bachelor’s degree and $19,000 for graduates with a Master’s or higher degree.
 
2017-09-15
The Innovation and Technology Venture Fund (ITVF), which aims to stimulate private investment in local innovation and technology start-ups, is now open for application by venture capital (VC) funds to become co-investment partners. The deadline of application is 15 January 2018.
 
2017-08-14
From 14 August 2017, electronic submission of applications for the Public Sector Trial Scheme for Incubatees and Graduate Tenants of Hong Kong Science & Technology Parks Corporation and Hong Kong Cyberport Management Company Limited (“PSTS-SPC”) is available in the ITC Funding Administrative System. Applications received via email on or after 25 August 2017 will not be accepted and applicants will be required to resubmit their applications through the ITC Funding Administrative System. For details of the PSTS-SPC, please refer to the Guide to Filling in the Application Form.
 
2017-06-15
From 15 June 2017, electronic submission of applications for the Internship Programme for Incubatees and SME Tenants of the Hong Kong Science & Technology Parks Corporation and Hong Kong Cyberport Management Company Limited (“IP-SPC”) is available in the ITC Funding Administrative System. Applications received via email on or after 26 June 2017 will not be accepted and applicants will be required to resubmit their applications through the ITC Funding Administrative System. For details of the Programme, please refer to the IP-SPC Application Guide.
 
2017-03-10
The Innovation and Technology Commission (ITC) will organise briefing sessions on the Technology Voucher Programme (TVP) from time to time. Interested parties please visit the TVP dedicated website for more information.
 
2016-12-19
The Public Sector Trial Scheme for Incubatees and Graduate Tenants of the Hong Kong Science & Technology Parks Corporation and Hong Kong Cyberport Management Company Limited ("PSTS-SPC") is now open for application.
 
2016-12-19
The Internship Programme for Incubatees and SME Tenants of the Hong Kong Science & Technology Parks Corporation and Hong Kong Cyberport Management Company Limited ("IP-SPC") is now open for application.
 
2016-11-21
The Technology Voucher Programme (TVP), which aims to subsidise local small and medium enterprises (SMEs) in using technological services and solutions to improve productivity, or upgrade or transform their business processes, is now open for application.
 
2016-10-14
The Innovation and Technology Commission Funding Administration System has been revamped. Users of Innovation and Technology Support Programme, University-Industry Collaboration Programme, Enterprise Support Programme, General Support Programme and Internship Programme should visit the new system. For users of Small Entrepreneur Research Assistance Programme (SERAP), please visit the old system.
 
2016-02-24
The rebate level of the R&D Cash Rebate Scheme has been increased from 30% to 40%. The enhanced level of rebate will be applicable to applications approved on or after 24 February 2016.

The maximum monthly allowance of the Internship Programme has been increased to $14,000 for graduates with a Bachelor’s degree and $16,500 for graduates with a Master’s or higher degree.
 
2015-04-28
Enterprise Support Scheme (ESS) is now open to application to replace the Small Entrepreneur Research Assistance Programme (SERAP).
 
2014-12-09
New Improvement Measures to the Innovation and Technology Fund Introduced + more

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Innovation and Technology Support Programme (ITSP)

  1. relaxing the minimum number of industry sponsors for platform projects from two to one;

  2. allowing platform projects conducted by local universities to accept sponsorship from a company which is related to the university;

University-Industry Collaboration Programme (UICP)

  1. relaxing the timeframe for projects from two years to three years;

  2. allowing flexibility for the company and the university participating in a project to negotiate and mutually agree on the IP arrangements;

  3. adopting the assessment framework of the ITSP for UICP projects; and

Public Sector Trial Scheme (PSTS)

  1. raising the funding ceiling of PSTS projects undertaken by R&D Centres from 50% to 100% of the original project cost.

For details, please refer to the paper endorsed by the Commerce and Industry Panel of the Legislative Council on 18 November 2014 – http://www.legco.gov.hk/yr14-15/english/panels/ci/papers/ci20141118cb1-211-3-e.pdf

 






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