|Between 1 and 28 February 2014, 14 newly funded projects are added to this website for public access.|
|The first round of funding applications for 2014 under Tier 2 and Tier 3 of the Innovation and Technology Support Programme (ITSP) is now open to application. Deadline for application is 31 March 2014. |
|The 2013 Guangdong - Hong Kong Technology Cooperation Funding Scheme (TCFS) has been closed for application on 10 October 2013.|
|The maximum funding support for Innovation and Technology Support Programme (ITSP) Tier 3 projects has been raised from $1.0 million to $1.4 million and for Seed projects (for R&D Centres) from $2.0 million to $2.8 million. |
The Innovation and Technology Commission has promulgated a new “Guide on Intellectual Property Arrangements for Research and Development Projects Funded under the ITSP of the ITF” which supersedes the previous two commercialization guidelines. The new Guide can be downloaded here.