Date Contents Categories
2021-06-08 The Innovation and Technology Commission (ITC) announced today (8 June 2021) the engagement of the Hong Kong Productivity Council (HKPC) as the secretariat of the Technology Voucher Programme (TVP). Details are available at the TVP website (u.hkpc.org/tvp). For enquiries on application progress or other matters, please contact the TVP Secretariat (telephone: 2789 7000; email: tvp-enquiry@hkpc.org). Announcement
2021-05-22 The 2021 Innovation and Technology Support Programme (ITSP) has been closed for application after 21 May 2021. Announcement
2021-05-22 The 2021 Mainland-Hong Kong Joint Funding Scheme (MHKJFS) has been closed for application after 21 May 2021. Announcement
2021-05-12 A new arrangement for the disbursement of the first instalment of ITF to ESS recipients has been introduced with a view to reducing the administrative procedures. It applies to applications being considered and recommended for support by the ESS Assessment Panel after 12 May 2021. Please refer to the ESS Funding and Administrative Guidelines for Successful Applicants issued on 12 May 2021 for the details. Announcement
2021-05-04 The cut-off date of the third batch of applications under the Re-industrialisation Funding Scheme (RFS) falls on 14 May 2021. Applications submitted after this date would be processed under the fourth batch. Announcement
2021-04-30 The STEM Internship Scheme has been regularised. Interested students and employers are welcomed to approach the participating universities for details. Contacts are available at the Scheme website. Announcement
2021-03-27 The fourth round of Midstream Research Programme for Universities (MRP) has been closed for applications after 26 March 2021. Announcement
2021-03-02 The eligibility for the Research Talent Hub is extended with immediate effect to holders of a bachelor's or master's degree in a science, technology, engineering and mathematics (STEM)-related discipline awarded by a well-recognised non-local institution. Announcement
2021-01-29 The second General Support Programme (GSP) Vetting Committee meeting in 2021 is scheduled for June 2021. The cut-off date for this round of applications is 31 March 2021. Announcement
2020-12-28 The Innovation and Technology Venture Fund (ITVF) has added three venture capital funds as co-investment partners. More details are available at the ITVF webpage and relevant press release. Announcement