Date Contents Categories
2022-11-14 The 2022 Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS) is now open for application. Deadline for application is 13 January 2023. Announcement
2022-10-11 The Innovation and Technology Venture Fund (ITVF) has added five venture capital funds as co-investment partners. More details are available at the ITVF webpage and relevant press release. Announcement
2022-10-01 The 2022 Innovation and Technology Support Programme (Platform & Seed) has been closed for application after 30 September 2022. Announcement
2022-09-07 The Public Sector Trial Scheme for Technology Companies Conducting Research and Development Activities in Hong Kong – Notes for Auditors of Recipient Organisations (PDF Format) had been issued in September 2022. Announcement
2022-09-06 The first General Support Programme (GSP) Vetting Committee meeting in 2023 is scheduled for February 2023. The cut-off date for this round of applications is 31 October 2022. Announcement
2022-08-22 The cut-off date of the seventh batch of applications under the Re-industrialisation Funding Scheme (RFS) falls on 9 September 2022. Applications submitted after this date would be processed under the eighth batch. Announcement
2022-07-01 The 2022 Mainland-Hong Kong Joint Funding Scheme (MHKJFS) has been closed for application after 30 June 2022. Announcement