Date Contents Categories
2024-05-21 The Hong Kong-Israel Research and Development Cooperation Programme is now open for application. Hong Kong companies can submit proposals to the Enterprise Support Scheme. Application deadline is 30 October 2024. Announcement
2024-05-13 The 2024 Mainland-Hong Kong Joint Funding Scheme (MHKJFS) is now open for application. Deadline for application is 28 June 2024. Announcement
2024-05-03 The General Support Programme (GSP) invites applications for funding all year round. The cut-off date will be 28 June 2024 for applications to be assessed in October 2024 to January 2025. Announcement
2024-04-23 The cut-off date of the twelfth batch of applications under the New Industrialisation Funding Scheme (NIFS) falls on 3 May 2024. Applications submitted after this date would be processed under the thirteenth batch. Announcement
2024-02-29 The second Fund for Better Living (FBL) Assessment Panel Meeting in 2024 is scheduled to take place in June / July 2024. The cut-off date for this round of application is 31 March 2024. Announcement
2024-01-25 The Enterprise Support Scheme has revised the procurement procedures of goods or services in relation to approved projects. More details are provided in the ESS webpage. Announcement
2024-01-13 The 2023/24 Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS) has been closed for application after 12 January 2024. Announcement
2024-01-08 Starting from 8 January 2024, New Industrialisation Funding Scheme (NIFS) allows each company to have in total 3 project applications and on-going projects under the scheme at any one time to receive total maximum funding of 45million. There is no limit on the total number of projects that may be approved in respect of a company under the scheme. More details are available at the NIFS webpage. Announcement
2023-12-27 The Innovation and Technology Venture Fund (ITVF) has added one venture capital fund as co-investment partner. More details are available at the ITVF webpage and relevant press release. Announcement
2023-10-28 The 2023 Innovation and Technology Support Programme (ITSP) (Platform & Seed) has been closed for application after 27 October 2023. Announcement
2023-10-18 The Government has launched the " Research, Academic and Industry Sectors One-plus Scheme" (RAISe+) to encourage local universities to promote the transformation and commercialisation of R&D outcomes. Funding will be provided on matching basis, with the Government providing a maximum of HK$100 million per project. More details are available at the RAISe+ webpage. Announcement
2023-09-23 The 2023 Innovation and Technology Support Programme (ITSP) (Mid-stream, theme-based) has been closed for application after 22 September 2023. Announcement
2022-10-11 The Innovation and Technology Venture Fund (ITVF) has added five venture capital funds as co-investment partners. More details are available at the ITVF webpage and relevant press release. Announcement
2022-09-07 The Public Sector Trial Scheme for Technology Companies Conducting Research and Development Activities in Hong Kong – Notes for Auditors of Recipient Organisations (PDF Format) had been issued in September 2022. Announcement